Potting of electronic соmponents
To ensure reliable operation and achieve the required IP rating, electrical components often require sealing and additional protection. OSV designs and manufactures robotic systems for the complete automation of the potting of various compounds for encapsulation.
Robotic systems for pouring and applying various compounds make it possible to fully automate the production process and reduce the operator’s role only to monitoring and controlling parameters. Mixing and dosing machines are equipped with three-coordinate displacement devices of various configurations, depending on the tasks.
Such systems provide a number of functions:
- Correct preparation of the potting compound
- Precise mixing ratio and dosing of material quantity
- Application accuracy and repeatability of doses
- No air bubbles and voids in the compound
The most commonly used potting materials are polyurethanes, silicones and epoxy resins from various manufacturers.
All equipment is designed and manufactured individually, taking into account all the features of the client’s production process.
